openfive

OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures with customizable and differentiated IP for artificial intelligence, edge computing, HPC, and networking solutions.OpenFiveoffers end-to-end expertise in architecture, design implementation, software, silicon validation and manufacturing to deliver high-quality silicon.

Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystem

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Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystem
Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystem

Overview

With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it.

This webinar will be useful to designers, architects, and application engineers to understand the solution required to scale high-performance compute (HPC) nodes.

Key Learnings

Target Audience

Speakers

Ketan Mehta
Sr. Director, Product/Application Marketing, Interface IP

As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning, and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high-performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.

Moderator

Overview

With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it.

This webinar will be useful to designers, architects, and application engineers to understand the solution required to scale high-performance compute (HPC) nodes.

CPU. Abstract digital chip computer processor and electronic components on motherboard or circuit board. Technology develop electronic devices on microchip or microprocessor, hardware engineering. AI.

Key Learnings

Target Audience

Speakers

Ketan Mehta
Sr. Director, Product/Application Marketing, Interface IP

As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning, and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high-performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.

Moderator

Register

This webinar is offered at three different times. Register for the time that works best for you.

Thursday, Sep 30
11:00 am Pacific Standard Time
(San Francisco)
Thursday, Sep 30
11:00 am European Standard Time
(Brussels)
Thursday, Sep 30
11:00 am China Standard Time
(Beijing)

Register

Thursday, Sep 30
11:00 am Pacific Standard Time
(San Francisco)

Register Now

Thursday, Sep 30
11:00 am Europian Standard Time
(Brussels)

Register Now

Thursday, Sep 30
11:00 am China Standard Time
(Beijing)

Register Now

Scalable HPC platform and memory expansion techniques using Die-to-Die and LPDDR subsystem

Webinars Overview

With advanced packaging and interface solutions, it is possible to connect multiple CPU clusters (near or far) and share external memory resources among them. We will review some of the IPs required to build such a platform and recommend applications that can benefit from it.

This webinar will be useful to designers, architects, and application engineers to understand the solution required to scale high-performance compute (HPC) nodes.

Key Learnings

Who should attend?:

Speakers

Ketan Mehta
Sr. Director, Product/Application Marketing, Interface IP

As the Sr. Director of Interface IP at OpenFive, Ketan Mehta is responsible for HBM Memory, Interlaken, Ethernet, Die-to-Die links, and other high-speed interfaces. With over 25 years of experience in engineering, product planning, and marketing, Ketan has a rich background in IP connectivity solutions for various applications including high-performance computing (HPC), AI, networking, data center, and storage. He received his M.S. degree in electrical engineering from The University of Texas at San Antonio, and his MBA from San Jose State University.

Moderator

REGISTER

This webinar is offered at three different times. Register for the time that works best for you.

Thursday, Sep 30
11:00 am Pacific Standard Time
(San Francisco)

Register Now

Thursday, Sep 30
11:00 am Europian Standard Time
(Brussels)

Register Now

Thursday, Sep 30
11:00 am China Standard Time
(Beijing)

Register Now