openfive

OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures with customizable and differentiated IP for artificial intelligence, edge computing, HPC, and networking solutions.OpenFiveoffers end-to-end expertise in architecture, design implementation, software, silicon validation and manufacturing to deliver high-quality silicon.

Events

Past Partner and Industry Events

22 - 24

Jun

2021
Shanghai, China
Virtual Event

OpenFive to demonstrate its AI Vision Platform at the RISC-V World Conference in China, ShanghaiTech University from June 22 to 24, 2021. OpenFive will also be delivering a talk on the topic “Platform for HPC and AI SoCs in Data Center Applications”.

21 - 22

Jun

2021
Tel Aviv, Israel
Virtual Event

OpenFive to exhibit at ChipEx 2021, Tel Aviv, Israel. Besides demonstrating its AI Vision Platform, OpenFive will also showcase its wide range of SoC IP portfolio and Custom SoC Solutions. This will be Live event on June 21 and Virtual on June 22.

02

Jun

2021
Japan
Virtual Event

OpenFive to participate in this year’s TSMC 2021 Technology Symposium Japan virtual event and showcase it’s SoC solutions for Advanced HPC/AI based on TSMC 5nm Technology.

02

Jun

2021
Europe
Virtual Event

OpenFive to participate in this year’s TSMC 2021 Technology Symposium Europe virtual event and showcase it’s SoC solutions for Advanced HPC/AI based on TSMC 5nm Technology.

01

Jun

2021
North America
Virtual Event

OpenFive to participate in this year’s TSMC 2021 Technology Symposium North America virtual event and showcase it’s SoC solutions for Advanced HPC/AI based on TSMC 5nm Technology.

25 - 28

May

2021
Virtual Event

OpenFive to participate in this year’s Embedded Vision Summit virtual event and showcase it’s AI Vision Platform

07 - 08

Feb

2021
India
Virtual Event

OpenFive will be presenting a paper on “Design Analysis of 2.5D Interposer”.

07 - 08

Oct

2020
India
Virtual Event

OpenFive will be presenting a paper on “Design Analysis of 2.5D Interposer”.

07 -08

Oct

2020
India – Virtual Event
OpenFive will be presenting a paper on “Design Analysis of 2.5D Interposer”.

15

Sep

2020
China – Virtual Event
Openfive will be presenting a paper on “Die-to-die connectivity interfaces for HPC and Chiplets“.

16

Oct

2020
EMEA – Virtual Event
OpenFive to showcase SoC IPs and Custom Silicon Solutions at its exhibit booth in Partner Pavilion.

17 -21

Oct

2020
Global – Virtual Event
53rd IEEE/ACM International Symposium on Microarcihitecture.

24

Sep

2020
North America – Virtual Event
OpenFive to showcase SoC IPs and Custom Silicon Solutions at its exhibit booth in Partner Pavilion.

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