Differentiate using our customizable SoC IP
Connectivity IP
Interlaken IP Subsystem
High speed chip-to-chip interface protocol with scalable bandwidth, low latency and reliable data transfer over serial links. The latest generation supports up to 1.2Tbps bandwidth with support for NRZ and PAM4 serial links. Learn more
Die-to-Die IP Subsystem
Die-to-Die Controller IP offers unique value proposition in terms of low power, high throughput and low latency links enabling faster time to integration for heterogenous chiplet connections in wired communications, AI and HPC applications. Learn more
USB IP Subsystem
Full range of USB controllers supporting USB2.0/USB3.0/USB3.1 gen1 and gen2 in host and device mode of operation. Supports AXI interface and in-built DMA features.Learn more
Interlaken IP SubSystem
High speed chip-to-chip interface protocol with scalable bandwidth, low latency and reliable data transfer over serial links. The latest generation supports up to 1.2Tbps bandwidth with support for NRZ and PAM4 serial links. Learn more
Die-to-Die IP SubSystem
Die-to-Die Controller IP offers unique value proposition in terms of low power, high throughput and low latency links enabling faster time to integration for heterogenous chiplet connections in wired communications, AI and HPC applications. Learn more
USB IP SubSystem
Full range of USB controllers supporting USB2.0/USB3.0/USB3.1 gen1 and gen2 in device mode of operation. Supports AXI interface and in-built DMA features.Learn more
Ethernet IP SubSystem
Comprehensive portfolio of fully configurable multi-channel, multi-rate Ethernet MAC, PCS, and FEC IP. Support for OIF FlexE in addition to IEEE802.3 standard for data center applications.Learn more
Memory Interface IP
HBM3/2E/2 IP Subsystem
The HBM3/2E/2 IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density. Learn more
LPDDR5/4X IP Subsystem
Achieving high-bandwidth with power and area efficiency, LPDDR5/4X is ideally suited for the next generation AI Inference, Edge, IoT, Automotive and Mobile applications. Learn more
HBM2/2E IP Subsystem
The HBM2/2E IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density. Learn more
LPDDR5/4X IP Subsystem
Achieving high-bandwidth with power and area efficiency, LPDDR5/4X is ideally suited for the next generation AI Inference, Edge, IoT, Automotive and Mobile applications. Learn more
