OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures with customizable and differentiated IP for artificial intelligence, edge computing, HPC, and networking solutions.OpenFiveoffers end-to-end expertise in architecture, design implementation, software, silicon validation and manufacturing to deliver high-quality silicon.
HBM3/2E/2 IP Subsystem
The HBM3/2E/2 IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density.
Integrated HBM controller and HBM PHY subsystem solution supporting HBM3, HBM2E and HBM2 JEDEC spec for a wide range of technology and foundry nodes. As an early advocate of 2.5D and 3D ASIC design technologies and by leveraging its experience from the industry’s first multiple successful 2.5D SoC SiP demonstration, OpenFive plays a key role in enabling industry applications that leverage the HBM 3D-stacked DRAM technology.
Best-in-class SoC IPs covering a wide range of applications from IoT devices, networking and AI/HPC
LPDDR5/4X IP Subsystem
Achieving high-bandwidth with power and area efficiency, LPDDR5/4X is ideally suited for the next generation AI Inference, Edge, IoT, Automotive and Mobile applications.Read More
Interlaken IP Subsystem
Interlaken IP is used by applications including NPU, traffic management and switch fabrics. OpenFive supports silicon-proven Interlaken IP with over 75+ tier 1 customers on various technology and process nodes.Read More
USB IP Subsystem
Full range of USB controllers supporting USB2.0/USB3.0/USB3.1 gen1 and gen2 in device mode of operation. Supports AXI interface and in-built DMA features.Read More
Die-to-Die IP Subsystem
Die-to-Die Controller IP offers unique value proposition in terms of low power, high throughput and low latency links enabling faster time to integration for heterogenous chiplet connections in wired communications, AI and HPC applications.Read More